Keysight Partners with Siemens EDA to Accelerate Product Development!

Keysight Technologies, Inc. and Siemens EDA have joined forces to boost the efficiency of wireless and defense system design. This strategic partnership integrates Keysight’s Advanced Design System (ADS) with Siemens’ Xpedition Enterprise suite of EDA tools, enabling engineers to seamlessly co-design digital systems and radio frequency (RF) circuits. By performing layout and manufacturing in Xpedition and conducting RF circuit and electromagnetic simulations in Keysight ADS, companies can achieve closed-loop quality control and Six Sigma consistency in unattended operations.

Today’s complex wireless and defense system designs require an unprecedented level of integration between RF and overall system design. These advanced solutions often incorporate intricate RF components, high-speed digital circuits, and sophisticated signal processing, all of which must function harmoniously to meet stringent performance standards.

Building on the prior dynamic inter-tool integration between Keysight and Siemens EDA, this collaboration enables bidirectional integration of system design with RF and microwave engineering tools. The integration facilitates complete hierarchical designs between Keysight ADS and Siemens Xpedition Designer and Layout, eliminating the cumbersome and error-prone task of manually translating libraries between the tools. Engineers can now transition effortlessly between detailed RF design in ADS and system-level design in Xpedition, maintaining design integrity throughout the entire development process.

This seamless integration is crucial for optimizing performance in areas such as 5G/6G communications, advanced radar systems, and electronic warfare applications, where the interplay between RF and digital domains is critical to system performance. The new integrated product is included in Keysight Advanced Design System 2025 and Siemens Xpedition Enterprise release 2409.

Nilesh Kamdar, EDA Design & Verification Lead at Keysight, stated, “We have a long-established track record collaborating with Siemens to support customers in enabling the next generation of wireless design. The bidirectional integration allows engineers to optimize performance across various applications, including 5G/6G and radar systems.”

AJ Incorvaia, Senior Vice President, Electronic Board Systems at Siemens Digital Industries Software, added, “As engineering teams strive to achieve digital transformation, the digital thread between RF and electronic system design becomes more critical. We’re pleased to announce improved integration enabling concurrent design to optimize system performance and improve quality while accelerating design closure.”

More from MTDCNC

Subscribe to our Newsletter today!

Stay up to date with the latest industry news and events.

Sign up today

Subscribe to the MTDCNC Newsletter