GlobalFoundries and NXP Semiconductors Collaborate to Deliver Next-Gen 22FDX Solutions for Automotive and IoT Markets!

GlobalFoundries (GF) and NXP Semiconductors have announced a strategic collaboration aimed at driving next-generation solutions across a diverse range of end markets, including automotive, Internet of Things (IoT), and smart mobile devices. This partnership leverages GF’s advanced 22FDX process technology platform and its extensive global manufacturing footprint to optimize the power, performance, and time-to-market of NXP’s innovative solutions. Under this agreement, GF’s 22FDX chips will be manufactured in both Dresden, Germany, and Malta, New York, ensuring NXP a geographically diversified supply chain to better serve their customers.

Building on a longstanding relationship, this new collaboration enables NXP to offer more compact, power-efficient solutions while significantly enhancing the overall performance of their system solutions. By utilizing GF’s 22FDX platform, which dynamically adjusts to the lowest possible voltage, NXP can achieve ultra-low power consumption and high performance, which is essential for the most demanding applications. Designed specifically for intelligence at the edge, the 22FDX platform optimizes energy management, delivering up to 50% higher performance and 70% less power consumption compared to other planar CMOS technologies.

Andy Micallef, Executive Vice President and Chief Operations and Manufacturing Officer at NXP, stated, “NXP’s innovative portfolio of high-performance solutions is crucial to enabling the essential technologies at the center of our increasingly connected world. GF’s 22FDX platform’s power efficiency and enhanced performance effectively enable our customers to build the next generation of connected and secure solutions. Additionally, GF’s robust manufacturing presence for 22FDX in Germany and the US helps support our goals of having supply control and geographic resilience in our manufacturing base.”

Niels Anderskouv, Chief Business Officer at GlobalFoundries, added, “Our close collaboration for over a decade has been a testament to the strength of our shared vision and commitment. As we move forward, we’re excited to build on this foundation and further enable NXP’s next-generation solutions with high power efficiency and optimal performance, without customers needing to compromise on either.”

The 22FDX platform not only maximizes performance per area by integrating digital, analog, RF, power management, and non-volatile memory (NVM) onto a single die but also offers best-in-class RF connectivity. This ensures responsive and reliable wireless connections for secure and straightforward operations. The integrated NVM reduces power consumption and latency while enhancing security—an essential feature given the expanding memory requirements for Edge AI processors. Through this comprehensive integration, NXP aims to create a one-stop platform serving multiple markets while maximizing intellectual property reuse.

Qualified for Automotive Grade 1 and 2 applications, the 22FDX technology ensures exceptional reliability in extreme automotive conditions. As part of GF’s AutoPro solutions, the 22FDX platform boasts advanced temperature-resistant capabilities up to 150°C junction temperature, crucial for the long-term durability and safety of vehicle electronic systems.

With a rich heritage of FDX innovation, GlobalFoundries maintains a robust portfolio of silicon and product-proven intellectual property for Automotive, Communications, and IoT applications. Supported by a secure, global supply chain, GF has shipped over 3 billion FDX chips to customers worldwide from Dresden and has expanded its shipping operations to Malta, NY. Following the companies’ previous joint development of 40nm NVM technology, GF is well-positioned to support NXP’s next-generation solutions for years to come through ongoing innovations in its FDX and FDX+ platforms.